Sale of New Equipment — Design & Fabricate

Semiconductor Equipment

We design, fabricate and sell new semiconductor processing equipment — from wet process and CMP to exhaust systems and active vibration isolation. All equipment is purpose-built to specification.

Wet Process Equipment

Wafer Cleaning & Chemical Handling

Precision equipment for wafer cleaning, chemical dispensing, and drying — designed and fabricated by SemiCo.

Wet bench system with robot rail and chemical tanks Wet bench chemical processing module
Design & Fabricate

Wet Bench Systems

Designed for RCA cleans, HF dips, and IPA drying with full safety compliance for semiconductor fabs.

Key Features

  • Robot rail with auto wafer transfer
  • Chemical tanks, heater tanks & chiller tanks
  • DIW rinse overflow tanks
  • Fluoropolymer (PVDF/PP) wetted parts
  • Exhaust-connected enclosure
Chemical Dispenser unit with AODD pump and magnehelic gauge
Design & Fabricate

Chemical Dispenser Units

Dual-line dispensing for acids and solvents — compatible with HF, HCl, H₂O₂ and IPA.

Key Features

  • AODD (air-operated double-diaphragm) pump
  • Magnehelic differential pressure gauge
  • DN200 exhaust connection
  • Clear PVC sight glass for level monitoring
  • Dual dispensing lines (AT-1 & AT-2)
SRD spin rinse dry single chamber SRD dual chamber configuration
Design & Fabricate

SRD — Spin Rinse Dry

Single or dual chamber configurations for silicon wafer cleaning and drying.

Specifications

  • Wafer size: 2–12 inch silicon wafers
  • Single or dual chamber configuration
  • Throughput: ≥200 WPH
  • DI water rinse + N₂ dry cycle

Panel Processing

CMP — Chemical Mechanical Planarisation

Large-format panel CMP systems custom-built for flat panel display substrates and advanced packaging applications.

CMP machine for 510×515 panels with dual platens
Design & Fabricate

CMP for 510×515 Panels

Dual-platen, dual-head polishing system for large-format panel substrates.

Machine Specifications

  • Overall dimensions: 10,800 × 3,370 × 2,650 mm
  • Dual platens / Dual polishing heads
  • Panel warpage tolerance: <±10 mm
  • Panel size: 510 × 515 mm
CMP tool layout with polisher, cleaner and automation modules
Design & Fabricate

CMP for 515×510 Panels

Full tool layout with automated panel handling between polishing and cleaning modules.

Tool Layout

  • Polisher A1 & A2 modules
  • Cleaner A1 & A2 modules
  • Automation A1 & A2
  • Power module & dryer
  • CV transport between modules

Advanced Materials

FOUP Cleaner & SiC Equipment

Specialist equipment for advanced packaging and silicon carbide wafer manufacturing.

FOUP cleaner process layout with loader, clean chamber and FFU
Design & Fabricate

FOUP Cleaner (510×515 Panels)

Front Opening Unified Pod cleaning for large-format carrier maintenance in advanced packaging fabs.

Process Modules

  • Loader / Unloader station
  • Clean chamber unit
  • FFU (Fan Filter Unit) for particle control
  • Tilt unit for drainage
  • Cover & body cleaning zones
Silicon carbide wafer fabrication process flow
SiC Fabrication

Equipment for SiC Wafers

Specialised equipment for the full silicon carbide wafer manufacturing flow — from boule to device-ready substrate.

Process Coverage

  • SiC powder → boule growth
  • Core drilling, slicing & lapping
  • CMP for SiC substrates
  • High-temp & high-hardness tooling
  • Epitaxy / device layer support

Vibration Control

K&S ArisMD Active Vibration Isolation

AI-integrated active vibration control — eliminating the need for expensive passive retrofits.

K&S ArisMD modular active vibration isolation system
Sale of New Equipment

K&S ArisMD Smart Pedestal

The ArisMD features internal vibration sensors, a smart analyzer, machine learning, and AI capabilities — built on a honeycomb platform with precision metal block load distribution.

6-DOF Degrees of Freedom
~20 dB Reduction at 3 Hz
<0.1s Settling Time
~8 dB Reduction at 1 Hz
Internal Vibration Sensors Smart Analyzer Machine Learning AI Capabilities Honeycomb Platform 24hr Real-Time Diagnostics

Design & Fabricate

Exhaust & Utility Systems

Engineered-to-order exhaust ducting, scrubbers, and ultra-pure water systems — 3D-designed and fabricated in-house.

Exhaust system 3D design with ducting layout Compressor room FAD layout design
Design & Fabricate

Exhaust System

Custom exhaust ducting and ventilation systems — 3D modelled, fabricated, and commissioned for semiconductor fabs.

What We Deliver

  • 3D design & engineering layout
  • Exhaust ducting & silencers
  • Exhaust fans & control panels
  • Compressor room FAD layout
  • Acid / ammonia scrubber integration
Flammable exhaust system with ATEX-compliant fans
Design & Fabricate

Flammable Exhaust System

Dedicated exhaust for flammable gas and solvent vapour — compliant with fire and explosion safety codes.

Key Features

  • Non-sparking, ATEX-compliant fans
  • Grounding & bonding throughout
  • Gas detection integration
  • SCDF / NEA authority submission support
RO system module EDI polishing unit RO+EDI control panel
Design & Fabricate

RO + EDI System

Reverse Osmosis and Electrodeionisation for ultra-pure water (DIW/PCW) production.

Key Features

  • Multi-stage RO pre-treatment
  • EDI polishing to 18 MΩ·cm
  • Resistivity & TOC monitoring
  • Integrated with cleanroom DIW/PCW loop

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Looking for a specific piece of equipment?

All our equipment is custom designed and fabricated to your process specifications. Contact us to discuss your requirements.

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