Equipment Solutions
Specialized equipment for wafer fabrication, chemical processing, panel manufacturing, and vibration control.
Wafer Processing
Precision equipment for wafer cleaning, chemical handling, and drying.
Critical for wafer cleaning and chemical processing — designed for RCA cleans, HF dips, and IPA drying with full safety compliance.
Precision dosing of acids and solvents — fluoropolymer construction ensures compatibility with HF, HCl, and IPA.
Single or dual chamber configurations. Capable of cleaning 2–12 inch silicon wafers with throughput of ≥200 WPH.
Safe storage solutions for acids, solvents, and flammable chemicals — designed to cleanroom and SEMI S2 standards.
Advanced Materials
Large-format panel and silicon carbide fabrication solutions.
Large-format panel processing (510×515) — optimized for flat panel display substrates and advanced packaging applications.
Front Opening Unified Pod cleaning systems maintaining contamination-free carrier environments for advanced packaging.
Specialized for silicon carbide wafer fabrication — handling high-temperature, high-hardness materials with advanced etching and polishing systems.
Vibration Control
AI-integrated active vibration control — eliminating the need for expensive passive retrofits.